Laser cutting is the use of a high-power density laser beam to irradiate the cut material, causing it to be quickly heated to the vaporization temperature and evaporate to form holes. As the beam moves the material, the holes continuously form narrow (such as around 0.1mm) slits, completing the cutting of the material. Laser cutting is one of the thermal cutting methods.
 

The updating and upgrading of laser equipment is becoming faster and faster, and the domestic and international laser industry has ushered in a period of rapid development, with nanoseconds, picoseconds, and femtoseconds gradually becoming hot topics in the market. Widely used in various manufacturing and processing industries such as sheet metal processing, aviation, aerospace, electronics, electrical appliances, subway accessories, automobiles, grain machinery, textile machinery, engineering machinery, precision accessories, ships, metallurgical equipment, elevators, household appliances, craft gifts, tool processing, decoration, advertising, metal external processing, kitchen utensils processing, etc.

So, what is the difference between nanoseconds, picoseconds, and femtoseconds in laser cutting?

1. The concept of the difference between nanoseconds, picoseconds, and femtoseconds in laser cutting:

The nanoseconds, picoseconds, and femtoseconds in laser processing equipment refer to the time control units in the laser processing process. Typically, laser processing involves a single pulse of energy acting on the material surface in a very short time, forming applications such as drilling, cutting, marking, and welding through high-frequency repetitive work.

At the same time, it should be noted that 1 second=109 nanoseconds=1012 picoseconds=1015 femtoseconds. Therefore, nanosecond, picosecond, and femtosecond laser processing equipment commonly seen in the market is named based on time, as well as various other factors such as single pulse energy, pulse width, pulse frequency, and pulse peak power. Based on the processing needs of different materials, corresponding nanosecond, picosecond, and femtosecond laser processing equipment should be selected. The shorter the time, the shorter the time that the laser acts on the material surface, the smaller the impact on the material surface, and the better the processing effect.

2. The difference between nanoseconds, picoseconds, and femtoseconds in laser cutting: Processing materials:

Under different processing conditions, different time units are selected, which is why there are naming rules for nanosecond, picosecond, and femtosecond laser equipment. For example, nanosecond ultraviolet laser cutting machines are often used for thin film material processing, picosecond ultraviolet laser cutting machines are often used for brittle material processing, and femtosecond ultraviolet metal laser cutting machines are used for conductive thin film oxide and other material processing (ultraviolet is named according to wavelength rules and is 355nm laser).

3. The difference between nanoseconds, picoseconds, and femtoseconds in laser cutting and its processing applications:

Laser drilling is one of the common applications of picosecond laser, which can complete hole processing through impact drilling and ensure hole uniformity. In addition to circuit boards, picosecond lasers can also drill high-quality holes in materials such as plastic films, semiconductors, metal films, and sapphires.

Line ablation (removal of coatings) is one of the micro processing applications of picosecond lasers, which precisely removes coatings without damaging or slightly damaging the substrate material. Ablation can be either a few microns wide line or a large area of removal in a few square centimeters. Due to the fact that the thickness of the coating is usually much smaller than the width of the ablation, heat cannot be transmitted on the side. Therefore, lasers with nanosecond pulse widths can be used.

Precision laser cutting is one of the common applications of femtosecond laser, which can be used to cut various substrates.

At present, the mainstream laser processing market in the market is still dominated by nanosecond lasers, due to the high cost of picosecond ultra fast laser cutting machines. The future trend is definitely towards the development of picosecond and femtosecond fields, and the future is foreseeable.

About HGTECH: HGTECH is the pioneer and leader of laser industrial application in China, and the authoritative provider of global laser processing solutions. We have comprehensively arranged laser intelligent machine, measurement and automation production lines, and smart factory construction to provide overall solutions for intelligent manufacturing.