Semiconductor Substrate Defect Detection Equipment
Defect Detection Series
Facing the upstream raw material manufacturing enterprises and the midstream wafer manufacturing enterprises in the semiconductor industry chain, the independent developed optical bright and dark field detection system is used to detect the appearance defects of semiconductor raw materials, epitaxial wafers and patterned wafers.

Product Data

Product advantages:

  • Applicable to a variety of wafers

          Suitable for 4-8 inch wafers, substrates, epitaxial wafers and patterned wafers

  • Can detect a variety of defects

          Detect particles, pits, bumps, scratches, stains, cracks and other defects

  • High resolution

          System resolution: 1-10 μ m 

  • Fast detection speed

          No pattern wafer: 180 seconds / wafer when the number of defects is less than 200


Sample display:

Sample 1

defect detection machine


Sample 2

defect detection machine


Sample 3

defect detection machine


Main parameters

General parameters

Wafer size

Standard 4 ", 6" (expandable 4 "- 8")

Number of boxes

Double-deck, 14 pcs

Loading and unloading method

Robot, mapping scanning

Motion platform

Y stroke 350mm,repetitive accuracy 10μm
Z strooke 8mm,repetitive accuracy 5μm


4" , 140WPH     6" ,  120WPH

Detection performance

Test accuracy

7 μm


High resolution industrial camera


HD industrial lens
Light source Patented light source

Environment requirement

Power supply specification

AC220V,   50Hz

Air source requirements

0 .5-0 .7Mpa compressed air, without obvious water vapor and grease

Using environment

Temperature: 15-40 ℃. Humidity requirement: 30% - 70%, no frost

Overall size


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