Product advantages:
Used for 4-8 inch original wafer, substrate and epitaxial wafer of various materials and polishing conditions
- High measurement accuracy
Thickness range: 0-1mm measurement accuracy: ± 1 μ M repetition accuracy: 0.2 μ m
Measurement time: 30s / PCS (according to the customer's detection trajectory)
Sample display:
Sample 1
![Semiconductor Wafer Thickness Measuring Equipment](../upload/20220819/62fef559b3842.png)
Sample 2
![Semiconductor Wafer Thickness Measuring Equipment](../upload/20220819/62fef561685a3.png)
Sample 3
![Semiconductor Wafer Thickness Measuring Equipment](../upload/20220819/62fef5690f530.png)