Wafer Laser Slotting Equipment
Wafer Slotting Series
This equipment is designed for 8-inch and above chip sealing and testing plants, and is applied to low-k wafers and silicon-based Gan wafers with 40nm and below in the semiconductor industry.
High-efficiency
High-quality
High-integration
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Product advantages:
- High quality
Use ultra short pulse processing to reduce edge collapse, delamination and thermal impact, and adopt high-precision visual positioning to ensure the slotting position
- High efficiency
Based on spatial light modulation technology, the size and shape of the shaping spot can be adjusted, and the laser energy utilization rate is high and the response is fast
- High integration
Integrated protective liquid coating, wafer slotting and cleaning module
Sample display:
Low-k wafer slotting, depth > 10 μm， Width: 40 μm.
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+86 27 8718 0225
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