Product advantages:
- Available in a variety of sizes
This equipment can be used for 4-8 inch patterned wafers
- Can detect a variety of defects
Detect defects such as scratch, back collapse, color difference, crack, scratch, metal residue and metal loss
- High precision resolution
System resolution: 0.2-0.8 μ m
Patterned wafer: 15 minutes / wafer when the number of defects is less than 200
Sample display:
The gold plating layer falls off
![defect detection machine](../upload/20220819/62ff00031e1c3.png)
Crackle
![defect detection machine](../upload/20220819/62ff001eba390.png)
Coating surface detection
![defect detection machine](../upload/20220819/62ff003dc82e7.png)
Scratch
![defect detection machine](../upload/20220819/62ff00528fc44.png)