On March 22nd, HGTECH exhibited its X-ray large-format marking machine for carriers and finished products, laser marking machine for FPC punching, and a series of solutions for the PCB industry at the Shanghai International Electronic Circuit Exhibition (CPCA Show). Showcasing a full range of laser + intelligent manufacturing solutions for the PCB industry, HGTECH Laser demonstrated its strength in the field of PCB.
 

With the development of global advanced communication and computer fields, the PCB industry has shown a trend towards high density, high integration, lightweight, and miniaturization. The PCB manufacturing is accelerating its transformation towards automation and intelligence.

As an annual event that connects the upstream and downstream of the electronic circuit industry and covers the entire industry chain, the CPCA Show brings together industry leaders, keeps up with global trends, and provides an important platform for exchange and display for the entire industry chain.
 

Carrier board X-RAY large board laser marking equipment
 

The equipment integrates X-ray code reading and laser processing QR code functions, realizing the inner layer code marking and inner and outer layer code conversion processing, giving the tiny chips a unique "ID card".

• It is compatible with the identification function of bad boards after panel board appearance inspection.
• Equipped with automatic loading and unloading mechanism and real-time monitoring function of laser power.
• The overall marking accuracy is ±50um.
• The processing efficiency can reach 200 pieces/hour.

Carrier Board Finished Board Laser Marking Equipment
 

Defect detection is an important part of chip production. This equipment is used for automatic identification and laser marking of scrap units on carrier board products after the defect detection process, improving product yield and process efficiency.
 

• It can achieve double-sided processing and dual-station operation, improving the quality and speed of marking for defective IC carrier boards.
• It can automatically recognize the position information of waste boards marked by front-end process marks or mapping files.
• Equipped with an energy monitoring system to ensure stable product processing.
• New programs can be made within 20 minutes, allowing for quick switching between products

FPC laser drilling equipment
 

This equipment is used for FPC drilling of through-holes and blind holes. It features precise control, flexible processes, and broad applicability, with high machining accuracy and consistency, effectively improving processing speed.

• Can be configured with a roll-to-roll structure for efficient production
• Supports multi-panel partitioning and positioning for processing, improving table utilization and efficiency
• Can automatically detect laser power and perform power compensation
• True roundness ≥ 90%, hole-to-diameter ratio of through-holes and blind holes > 85%
• Linked with 240 holes/s, spliced with 200 holes/s

About HGTECH

HGTECH is the pioneer and leader of laser industrial application in China, and the authoritative provider of global laser processing solutions. We comprehensively layout the construction of laser intelligent equipment, measurement and automation production lines, and smart factories to provide an overall solution for intelligent manufacturing.

We deeply grasp the development trend of manufacturing industry, constantly enrich products and solutions, adhere to exploring the integration of automation, informatization, intelligence and manufacturing industry, and provide various industries with laser cutting systems, laser welding systems, laser marking series, laser texturing complete equipment, laser heat treatment systems, laser drilling machines, lasers and various supporting devices The overall plan for the construction of special laser processing equipment and plasma cutting equipment, as well as automatic production lines and smart factories.