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Laser cutting is to use a high power density laser beam to irradiate the material to be cut, so that the material is quickly heated to the vaporization temperature and evaporated to form a hole. With the beam moving on the material, the hole continuously forms a narrow slit (such as about 0.1mm) to complete the cutting of the material. Laser cutting is one of the thermal cutting methods.
The laser machine is being updated and upgraded more and more quickly. The laser industry at home and abroad has ushered in a period of rapid development, and nanosecond, picosecond and femtosecond have gradually become the focus of the market.
It is widely used in various manufacturing and processing industries such as sheet metal processing, aviation, aerospace, electronics, electrical appliances, subway accessories, automobiles, grain machinery, textile machinery, engineering machinery, precision accessories, ships, metallurgical equipment, elevators, household appliances, craft gifts, tool processing, decoration, advertising, metal external processing, kitchen utensils processing, etc.
So, what is the difference between nanosecond, picosecond and femtosecond of laser cutting? Lixing laser technical engineer will answer for you.
Analysis of the difference between nanosecond, picosecond and femtosecond of laser cutting:
1.The Difference Between Nanosecond, Picosecond And Femtosecond In Laser Cutting:
The nanosecond, picosecond and femtosecond in the laser processing equipment refer to the time control unit in the laser processing process. Generally, laser processing is a single pulse energy that acts on the material surface in a very short time, and forms drilling, cutting, marking, welding and other applications through high-frequency repetitive work.
At the same time, it is necessary to understand that 1s=109 nanoseconds=1012 picoseconds=1015 femtoseconds, so the nanosecond, picosecond and femtosecond laser processing equipment often seen in the market are named according to the time criterion, and there are also various other factors such as single pulse energy, pulse width, pulse frequency, pulse peak power, etc., according to the processing requirements of different materials, select the corresponding nanosecond, picosecond and femtosecond laser processing equipment. The shorter the time, the shorter the time that the laser acts on the material surface, the smaller the impact on the material surface, and the better the processing effect.
2.The Difference Between Nanosecond, Picosecond And Femtosecond Of Laser Cutting:
Under different processing conditions, different time units are selected, so there are naming rules for nanosecond, picosecond and femtosecond laser equipment. For example, nanosecond ultraviolet laser cutting machine is often used for thin film material processing, picosecond ultraviolet laser cutting machine is often used for brittle material processing, femtosecond ultraviolet laser cutting machine is used for conductive thin film oxide and other materials processing (ultraviolet is named according to wavelength rules, 355nm laser).
3.The Difference Between Nanosecond, Picosecond And Femtosecond Of Laser Cutting:
Laser drilling is one of the common applications of picosecond laser. Picosecond laser can complete the hole processing by means of impact drilling and ensure the uniformity of the hole. In addition to circuit boards, picosecond lasers can also drill high-quality holes in plastic films, semiconductors, metal films, sapphires and other materials.
Linear ablation (removal of coating) is one of the applications of picosecond laser micromachining, which can accurately remove the coating without damaging or slightly damaging the substrate material. Ablation can be either a few microns wide line or a few square centimeters of large area removal. Because the thickness of the coating is usually far less than the width of the ablation, the heat cannot be conducted on the side. Therefore, nanosecond pulse width laser can be used.
About HGTECH: HGTECH is the pioneer and leader of laser industrial application in China, and the authoritative provider of global laser processing solutions. We have comprehensively arranged laser intelligent machine, measurement and automation production lines, and smart factory construction to provide overall solutions for intelligent manufacturing.
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