Patented perforation technology, empowering the drilling of flexible circuit boards.

Flexible Copper Clad Laminate（FCCL） is widely used to make flexible circuit boards because of its excellent characteristics such as thinness, flexibility, electrical properties, heat resistance and easy cooling.

The main process stage of FPC molding - drilling, the quality of which directly affects the mechanical assembly and circuit connection performance of flexible electronic material boards.The right drilling method can play the role of signal conduction and adapt to the processing needs of smaller size boards by multi-layer stacking.

Problems with traditional processing methods

Traditional mechanical drilling technology is difficult to achieve micro-hole processing. The depth is not controllable during blind hole processing, and also requires frequent tool changes.

Laser drilling technology generally uses concentric circle and spiral scanning methods. The concentric circle scanning method is scanning processing from the outside to inside, and the resulting blind hole has more macromolecular residue inside; while the spiral line processing from the inside to the outside causes a deeper peripheral depth. Both processing methods cause low flatness at the bottom of the blind hole and uneven edges of the hole pattern.

Smooth blind holes with one punch

In order to meet the technical processing pain points and meet the market and process needs, HGTECH is deeply engaged in the 3C electronic manufacturing industry and has developed its own patented technology - FPC Laser Shield punching technology to develop UV high-speed drilling equipment to realize blind hole forming in one punch.

HGTECH UV high speed drilling equipment

HGTECH self-developed FPC Laser Shield drilling technology is a bold innovation based on the removal principle.

By changing the energy distribution state of the light spot, the shield-shaped light spot diffracted through the optical DOE device can be directly applied to the material surface without any line sweeping, and the blind hole can be formed in one blow at high speed.

The advantages of this technology：

• it can improve the ablation phenomenon caused by high energy in the center of the spot, and make the surface of the copper foil at the bottom of the blind hole more flat and smooth.

Under 2000x electron microscope, the hole shape is round and the copper bottom is clean and flat

• the spot size can be adjusted electrically through synchronous DOE, which effectively reduces the hole shape out of round caused by the changing of the vibrating mirror and acceleration/deceleration. It can also quickly switch the size to meet the removal needs of different hole sizes and greatly improve the drilling efficiency!

Stable quality and high efficiency

In the drilling process, HGTECH UV high-speed drilling equipment adopts IFOV technology, which synchronizes the control of linear motor platform, mirror scanning system and laser pulse to achieve infinite field of view motion control function. Therefore, it achieves the purpose of improving drilling and cutting efficiency and product quality. In addition to the software algorithm optimization（20% more efficient than the same type of equipment in the market）, it achieves high stability and high efficiency laser drilling.

HGTECH UV high-speed drilling equipment drilling effect and hole size display

HGTECH UV high-speed drilling equipment has been widely used in the 3C electronic manufacturing field, the yield and efficiency of drilling and blind hole processing have been highly praised by customers

About HGTECH: HGTECH is the pioneer and leader of laser industrial application in China, and the authoritative provider of global laser processing solutions. We have comprehensively arranged laser intelligent equipment, measurement and automation production lines, and smart factory construction to provide overall solutions for intelligent manufacturing.