The chips of mobile phones, computers, cars and other products cannot be separated from semiconductors. Wafers are like the mother material of semiconductors, and the precision of their production and manufacturing directly affects the performance of semiconductor chips.

As a processing tool, laser plays a crucial role in ensuring the performance of semiconductor chips. Recently, HGTECH has manufactured China's first high-end wafer laser cutting equipment with 100% localization of core components, and has won multiple Chinese firsts in the field of semiconductor laser equipment.

Optimization Of Semiconductor Wafer Cutting Technology

Huang Wei, Director of Semiconductor Products at HGTECH, introduced: "Semiconductor wafers are hard and brittle materials, with thousands or even tens of thousands of chips on a 12 inch wafer. Whether mechanical or laser methods are used for wafer cutting and chip separation, thermal effects and edge collapses will occur due to material contact and high-speed motion, thereby affecting chip performance. Therefore, controlling the diffusion range of thermal effects and the size of edge collapses is crucial.

Leading Technical Advantages Of HGTECH

HGTECH has leading domestic advantages in laser equipment research and development, manufacturing technology, and the entire industry chain in the industrial laser field. It has formed three major business patterns: intelligent manufacturing equipment business supported by laser processing technology, optical connection and wireless connection business supported by information and communication technology, sensors supported by sensitive electronic technology, and laser anti-counterfeiting packaging business.

In the field of semiconductors, HGTECH actively arranges and has reached strategic cooperation with multiple semiconductor leading enterprises such as Changfei Advanced. HGTECH have developed semiconductor laser invisible cutting and scoring equipment and SiC substrate appearance defect detection equipment to solve the technical problem of neck blockage and achieve domestic substitution.

In terms of HGTECH’s international business, the company exported high-end equipment such as IC carrier board XOUT defect identification equipment, PCBA marking and splitting equipment, and IC chip sorting equipment to Southeast Asia, South Korea, Japan, India, Europe, the Americas, and other regions overseas in 2022, achieving a year-on-year increase of 55% in international orders.

About HGTECH

HGTECH is the pioneer and leader of laser industrial application in China, and the authoritative provider of global laser processing solutions. We comprehensively layout the construction of laser intelligent equipment, measurement and automation production lines, and smart factories to provide an overall solution for intelligent manufacturing.

We deeply grasp the development trend of manufacturing industry, constantly enrich products and solutions, adhere to exploring the integration of automation, informatization, intelligence and manufacturing industry, and provide various industries with laser cutting systems, laser welding systems, laser marking series, laser texturing complete equipment, laser heat treatment systems, laser drilling machines, lasers and various supporting devices The overall plan for the construction of special laser processing equipment and plasma cutting equipment, as well as automatic production lines and smart factories.