Nowadays, due to the rapid development of science and technology, many products on the market are designed with many microporous structures. Laser micro processing technology has been widely applied in industries such as 3C electronics, smart wearables, mobile phones, and healthcare. These holes on the product have the characteristics of small size, dense quantity, and high machining accuracy requirements.

Principles of Laser Microprocessing

Laser micro processing technology relies on its high intensity, good directionality, and coherence. Through a specific optical system, the laser beam can be focused into a spot with a diameter of several micrometers. Its energy density is highly concentrated, and the material will quickly reach the melting point and melt into a molten substance. As the laser continues to act, the molten substance begins to vaporize, generating a fine vapor layer, forming a state of coexistence of vapor, solid, and liquid phases. During this period, due to the effect of steam pressure, the molten material will be automatically splashed out, forming the initial appearance of the hole. As the duration of laser beam irradiation increases, the depth and diameter of the micropores continue to increase until the laser irradiation is completely completed. The molten material that has not been splashed out will solidify, forming a recast layer, in order to achieve the purpose of laser micromachining.

Process Stage Division of Laser Microprocessing

The first step is to directly irradiate the laser beam on the workpiece, and the workpiece begins to absorb laser energy. The second step is to convert laser light energy into thermal energy, which quickly heats the workpiece; Next, the workpiece partially begins to melt, evaporate, vaporize, and splash out; Finally, the laser action ends and the remaining condensation forms a recast layer. Among them, the depth of micropores produced by laser micro processing within a certain range is positively correlated with the number of laser pulses, while the taper of micropores is negatively correlated with the energy of a single laser pulse. The number of laser pulses and the energy of a single laser pulse will have an impact on the shape of the processed micropores. Therefore, laser unprocessed technology can achieve the desired processing effect by selecting the appropriate number of laser pulses and single pulse energy.

Processing Methods of Laser Microprocessing

When using commonly used serial processing for high-density micro hole arrays, there are problems such as low processing efficiency and long processing time. When using laser to process a single micro hole, the efficiency is very high. Laser splitters can split laser beams and achieve parallel processing, and the use of laser parallel processing technology can optimize and solve this series of problems. At present, various corresponding laser beam splitters have been developed in the market, such as spatial modulators, splitting prisms, etc.

Conclusion

With the increasing demand for micro processing of high-precision products and mechanical components in the market, and the development of laser micro processing technology becoming more mature, laser micro processing technology will be more and more widely used in the processing of high-precision products due to its advanced processing advantages, high processing efficiency, small material limitations, no physical damage, and intelligent and flexible control.

About HGTECH

HGTECH is the pioneer and leader of laser industrial application in China, and the authoritative provider of global laser processing solutions. We comprehensively layout the construction of laser intelligent equipment, measurement and automation production lines, and smart factories to provide an overall solution for intelligent manufacturing.

We deeply grasp the development trend of manufacturing industry, constantly enrich products and solutions, adhere to exploring the integration of automation, informatization, intelligence and manufacturing industry, and provide various industries with laser cutting systems, laser welding systems, laser marking series, laser texturing complete equipment, laser heat treatment systems, laser drilling machines, lasers and various supporting devices The overall plan for the construction of special laser processing equipment and plasma cutting equipment, as well as automatic production lines and smart factories.