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: Technical Analysis of 3D Fiber Laser Cutting Machine (2) At present, the main manufacturers of 3D five axis laser cutting machines include Trumpf in Germany, Prima in Italy, NTC in Japan, Mitsubishi in Japan, and HGLASER in China. more

: Technical Analysis of 3D Fiber Laser Cutting Machine (1) The three-dimensional five axis fiber laser cutting machine is regarded as the pearl on the crown of high-power laser processing equipment. more

: Breaking Through The Sky In Key Core Technologies Enterprises must constantly achieve breakthroughs in core technologies, master more key technologies with independent intellectual property rights, and control the leading power of industrial development. more

: Introduction and Application of the Working Principle of 3D Fiber Laser Cutting Machine The 3D fiber laser cutting machine is a 3D laser cutting equipment that uses advanced fiber lasers, fiber scanning, CNC systems, control systems, and other key technologies. It is a high-precision laser cutting machine. more

: "China Optics Valley" Achieving Breakthrough In 3D Laser Cutting Wuhan Donghu New Technology Development Zone is known as the "China Optics Valley". It is not only the world's largest research and production base for fiber optic cables, but also the largest laser industry base in China. more

: Scientists have Developed Low-Power Nanoscale Laser Cutting Technology Requiring Only 0.5-20 MW 2022-08-25 Recently, scientists at McGill University have developed a milder and more accurate laser cutting technology using low-power visible light, which may overturn the previous appearan...

: Which of The Four Processing Methods of Laser Cutting is More Suitable for your Preference? 2022-08-24 How to improve the efficiency of laser cutting machine under the background of higher and higher processing efficiency requirements? What are the conventional processing methods？

: Laser and Automation Brings New Wind to PCB Industry 2022-08-23 IC carrier board is a key specialized base material used in advanced packaging, and is the largest value of consumables in semiconductor packaging. It is small in size, thin in thi...

: HGTECH Self-Developed FPC Laser Shield: Patented Perforation Technology, Empowering the Drilling of Flexible Circuit Boards 2022-08-22 In order to meet the technical processing pain points and meet the market and process needs, HGTECH is deeply engaged in the 3C electronic manufacturing industry and has developed ...

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